The Additive Manufacturing Users Group (AMUG) has announced the awardees of the Randy Stevens Scholarship and Guy E. Bourdeau scholarship. The scholarships seek to recognize students and teachers that demonstrate a passion for additive manufacturing.
The first award, the Randy Stevens scholarship, will go to John Sorvillo, Director for Westwood Prep Academy at New Beginnings in Youngstown, Ohio. Picking up the second award, the Guy E. Bourdeau Scholarship, is University of Cincinnati Ph.D. student, Sean Dobson.
As scholarship awardees, Sorvillo and Dobson will attend this year’s AMUG conference from 2-6 May and will be given the opportunity to present their work on-stage during the event.
“Educators are using AM to expand minds and stretch the boundaries of education,” said Brett Charlton, Chair of the AMUG Scholarship Committee. “Students are tackling significant issues and expanding the applications of AM in the world. The applications are numerous, amazing, and inspiring.
“The committee had quite a challenge in making selections, but it determined that John Sorvillo and Sean Dobson epitomized what the scholarships represent.”
The Randy Stevens scholarship
Sponsored by Minnesota-based manufacturing service bureau In’Tech Industries, The Randy Stevens Scholarship is awarded annually to one high school teacher or college or university professor for their contribution to 3D printing in education and professional development.
Sorvillo is an elementary school teacher and Director of Westwood Preparatory Academy, where the students are in residential care, and many are without familial provisions. Initially, the academy had one 3D printer, which was difficult to incorporate into instructional lessons, but with Sorvillo’s efforts, the school now has four printers that help facilitate the teaching of life skills and technical know-how, such as CAD design.
“Our 3D printing program has played a huge role in creating inspiration,” he said. “We’re able to show at-risk students a whole new way of learning. This technology has opened avenues of teaching that we never imagined. We are able to positively impact many facets of our students’ lives.
“3D printing has given us the ability to make our kids a positive force in our community.”
Sorvillo has extended the academy’s classroom education through various partnerships, collaborations, and grants in the form of outreach programs that benefit both the students and the wider community. According to Charlton, Sorvillo’s use of 3D printing to “make this world a better place through building people” is what won him the scholarship.
When asked why he wanted to be a part of the AMUG conference, Sorvillo replied: “I would love to see how this equipment operates in the larger picture of the entire industry and how we can incorporate that into lessons to better help our kids have a shot at success. I would like to take the opportunity to make contacts in this industry who can help us educate our students on what it takes to enter this field as a business owner.”
The Guy E. Bourdeau Scholarship
The Guy E. Bourdeau Scholarship is financially supported by Cimquest, a New Jersey-based reseller of CAD/CAM and 3D printing technology. It is awarded annually to a college student for their contribution to 3D printing in education. By providing access to the AMUG conference, the scholarship seeks to enable students to absorb shared knowledge at the event and develop industry contacts.
Dobson’s introduction to 3D printing began during his undergraduate studies at the University of Louisville when he completed an internship in Gulfstream Aerospace’s 3D printing lab, an aircraft firm, and General Dynamics subsidiary. After leaving the internship with a “newfound desire” for additive manufacturing, Dobson became a research undergraduate at the university’s Rapid Prototyping Center (RPC) and discovered an interest in metal 3D printing that saw him work on RPC projects for organizations such as NASA and the US Navy.
Dobson’s senior product involved creating an affordable, modular desktop 3D printing for fused filament fabrication (FFF), CNC milling, laser cutting, and injection molding, which eventually led to him co-founding ModMan Technology. Dobson continued his research for the US Navy’s project while earning his master’s degree in mechanical engineering as a graduate research assistant.
Presently, Dobson is working towards a Ph.D. in material science at the University of Cincinnati while working as an Additive and Material Engineer for 3D printing service provider Vertex Manufacturing.
CEO of Vertex Manufacturing, Greg Morris, said: “He has been a tremendous asset to Vertex Manufacturing. The passion that Sean exhibits for this field of work on a daily basis is inspiring, even for those of us who share the same passion.”
When asked why he wants to attend the AMUG conference this year, Dobson answered: “AMUG is a place where the titans of our industry meet to discuss the current state of AM year after year; a place where individuals come to learn and share. This is why I want to attend AMUG; to learn from those who have experience far beyond my own, and to share what I have learned with those who may just be starting out.”
AMUG Conference 2021
At the end of last year, AMUG announced its 2021 conference would be relocated to Orlando on Covid-19 safety grounds. Although the plans are subject to change, the event is still expected to take place in-person between 2-6 May.
The AMUG conference sees additive manufacturing experts and leaders come together to share their insights and ideas, featuring high-profile keynote speakers, training opportunities, and additive awards that recognize the year’s achievements.
The 2020 edition of the event was postponed last year due to the pandemic, and attendees to the 2021 conference can expect to see the same program of exhibitors that were promised in AMUG’s original format.
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Featured image shows John Sorvillo (left), Randy Stevens Scholarship recipient, and Sean Dobson, Guy E. Bourdeau Scholarship recipient. Image via AMUG.