Formnext Asia Shenzhen, the additive manufacturing trade show organized by Guangzhou Guangya Messe Frankfurt Co Ltd, will return to the Shenzhen World Exhibition & Convention Center from August 26 to 28, 2026, with a focus on how 3D printing is being used to produce liquid cooling components for AI infrastructure. As higher-density AI server chips generate more heat than traditional air cooling can handle efficiently, the exhibition will highlight the machines, materials, software, post-processing technologies, and production services used to manufacture these parts.
Liquid cooling is becoming more important as AI computing loads increase. In these systems, coolant passes through metal cold plates mounted directly on chips, removing heat before it builds up. Producing those parts becomes difficult when internal channels need to curve, branch, or closely follow chip layouts. Conventional machining can make straight passages, but more complex designs often require multiple metal parts to be joined together, creating possible leak paths. Additive manufacturing offers another manufacturing route by producing cold plates and heat exchangers as single metal components with internal channels built into the part.
Formnext Asia Shenzhen said a confirmed group of exhibitors will cover the liquid cooling production chain from raw materials to batch manufacturing services. Farsoon Technologies, a Chinese industrial 3D printing systems manufacturer, Addireen, BCX Laser, FastForm3D, Han’s Laser, Southern Additive, and UNILASER are expected to present laser and selective laser melting systems capable of processing pure copper and copper alloys. Those materials are used in cooling applications because of their high thermal conductivity, but they have historically been difficult to process in metal additive manufacturing. Grinm Additive, a supplier of metal powder materials, and Zhongyuan Advanced Materials, a producer of industrial powders, will present aluminum and copper powders developed for 3D printed cooling components. HP 3D Printing, the additive manufacturing business of HP, will demonstrate binder jetting for batch production of copper cooling parts, while Uprise 3D will exhibit powder extrusion systems for technical ceramics used in insulation and thermal management.
Forecasts cited in the event announcement indicate why this segment is receiving attention. Goldman Sachs projects liquid-cooled AI servers will rise from 15% market penetration in 2024 to 76% in 2026. Reuters, citing a JPMorgan report, said the global market for AI server liquid cooling systems is expected to exceed $17 billion this year, up from $8.9 billion last year. Formnext Asia Shenzhen will also introduce a new Thermal Management and Liquid Cooling AM Forum featuring industry experts and representatives from exhibiting companies presenting cases involving 3D printed components used in AI server environments. Additional sessions in the fringe program will examine additive manufacturing applications in low-altitude aviation and drones, new energy vehicles, and robotics.
PCIM Asia Shenzhen, a regional exhibition and conference focused on power electronics, intelligent motion, renewable energy, and energy management, will run alongside the event. In 2026, PCIM Asia Shenzhen will also expand its focus on AI and data center applications. The co-location places additive manufacturing suppliers in the same venue as engineers, component suppliers, and system specialists working on power requirements for high-density computing, while also bringing them closer to end-use requirements, procurement activity, and business relationships shaping demand in this area. Formnext Asia Shenzhen is part of the wider Formnext event portfolio, which also includes Formnext in Frankfurt, Germany, scheduled for November 17 to 20, 2026.
3D Printing Industry is inviting speakers for its 2026 Additive Manufacturing Applications (AMA) series, covering Energy, Healthcare, Automotive and Mobility, Aerospace, Space and Defense, and Software. Each online event focuses on real production deployments, qualification, and supply chain integration. Practitioners interested in contributing can complete the call for speakers form here.
To stay up to date with the latest 3D printing news, don’t forget to subscribe to the 3D Printing Industry newsletteror follow us on LinkedIn.
Explore the full Future of 3D Printing and Executive Survey series from 3D Printing Industry, featuring perspectives from CEOs, engineers, and industry leaders on the industrialization of additive manufacturing, 3D printing industry trends 2026, qualification, supply chains, and additive manufacturing industry analysis.
Featured photo shows Exhibition floor at Formnext Asia Shenzhen 2025. Photo via Guangzhou Guangya Messe Frankfurt Co Ltd.
