A research team from the Korea Advanced Institute of Science and Technology (KAIST), together with collaborators from Korea University and the University of Hong Kong, has developed what they describe as the world’s first room-temperature 3D printing method capable of fabricating miniature infrared sensors in customizable shapes and sizes. These sensors—used in applications such as LiDAR systems, 3D face recognition, and wearable healthcare devices—are key components in next-generation electronics.
This research was supported by the Ministry of Science and ICT of Korea through the Excellent Young Researcher Program, the National Strategic Technology Material Development Program, and the International Cooperation Research Program for Original Technology Development.
New 3D Printing Method Using Nanocrystal Inks
Conventional semiconductor fabrication processes allow large-scale production but require high temperatures and rigid designs, limiting flexibility and material options. To overcome these challenges, the team developed a precise 3D printing process that stacks metal, semiconductor, and insulator materials in the form of liquid nanocrystal inks within a single printing platform.
The approach uses a ligand-exchange technique to replace insulating molecules on nanoparticle surfaces with conductive ones, improving electrical performance without the need for high-temperature annealing. This enables direct fabrication of infrared sensors at room temperature while maintaining high performance and structural precision. The resulting sensors measure less than one-tenth the thickness of a human hair.
“The developed 3D printing technology not only advances the miniaturization and lightweight design of infrared sensors but also paves the way for the creation of innovative new form-factor products that were previously unimaginable,” said Professor Ji Tae Kim. “Moreover, by reducing the massive energy consumption associated with high-temperature processes, this approach can lower production costs and enable eco-friendly manufacturing—contributing to the sustainable development of the infrared sensor industry.”
Additive Manufacturing Meets Semiconductor Design
The KAIST team’s achievement aligns with a broader trend toward using AM to reimagine semiconductor production.
At the Massachusetts Institute of Technology (MIT), researchers recently demonstrated fully 3D printed resettable fuses—core components in electronic circuits—using a biodegradable polymer infused with copper nanoparticles. Traditionally reliant on advanced semiconductor fabrication processes, these devices were instead produced with standard 3D printing hardware and low-cost materials. Partially funded by Empiriko Corporation, the development is expected to bring electronics production to businesses, labs, and even homes.
Meanwhile, a collaborative team from Sandia National Laboratories, the University of Illinois at Urbana-Champaign, Oregon State University, and MIT is enhancing process precision through a real-time monitoring and control system for direct ink write 3D printing. Using infrared thermography and optical sensing, their system tracks curing reactions in real time, dynamically adjusting parameters such as ink flow and printhead speed for optimal material performance.
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Featured image shows Professor Ji Tae Kim of the Department of Mechanical Engineering, Professor Soong Ju Oh of Korea University and Professor Tianshuo Zhao of the University of Hong Kong. Image via KAIST.
