US-based 3D printer manufacturer Boston Micro Fabrication (BMF) has been granted U.S. Patent No. 12,420,486 B2 for its “Multi-Scale System for Projection Micro Stereolithography.” Issued by the United States Patent and Trademark Office (USPTO) on September 23, 2025, the patent protects a dual-resolution optical system that underpins the company’s microArch D1025 3D printer. The development enables rapid, high-accuracy production of micro-scale parts across larger build areas.
The patented optical system integrates multiple projection lenses with distinct imaging ratios—10-micron and 25-micron resolutions—within a single optical path. This configuration allows the 3D printer to dynamically switch between resolutions during fabrication, optimizing for both fine detail and throughput. By combining two imaging scales, the 3D printer manufacturer’s design enhances the efficiency of Projection Micro Stereolithography (PµSL) while maintaining micron-level precision in complex geometries.
“This patent reinforces our leadership in ultra-high-precision additive manufacturing,” said John Kawola, CEO of Boston Micro Fabrication. “The dual-resolution architecture delivers a unique combination of speed and accuracy, allowing engineers to fabricate micro parts with both intricate fine features and larger geometries in a single print.”
The system automatically allocates 10-micron exposures for critical features and 25-micron exposures for larger areas, achieving consistent dimensional accuracy while reducing print times. This dual-lens approach provides a workflow suited for both detailed structures and broader production needs.
Inventors Dr. Chunguang Xia and Dr. Jiawen Xu are named on the patent, which is assigned to BMF Material Technology Inc. of Shenzhen, China, the parent company of Boston Micro Fabrication. Dr. Xia, who also serves as BMF’s Chief Technology Officer, described the development as an optical advancement with long-term implications for microscale production. “The microArch D1025 embodies our mission to push the limits of what’s possible at the microscale,” he said. “This dual-resolution system is not only a major optical breakthrough—it’s a platform that enables the next generation of micro-fabricated devices.”
Projection Micro Stereolithography uses digital light projection to cure photosensitive resin layer by layer, producing features as small as a few microns. Founded in 2016, Boston Micro Fabrication operates offices in Boston, Shenzhen, Chongqing, and Tokyo, and uses its proprietary PµSL process to manufacture high-resolution 3D printed parts for medical, electronic, photonic, microfluidic, and research applications. The company’s systems are widely used in laboratories and production environments where precision and repeatability are essential.
Introduced in 2024, the microArch D1025 was the first commercial 3D printer to employ the dual-resolution concept. Manufacturers in medical, electronic, and research sectors have adopted the system for applications requiring both fine-feature detail and larger supporting geometries. Its adaptive dual-lens mechanism offers a combined approach to throughput and accuracy in a single build process.
With the U.S. patent now granted, BMF aims to expand this dual-resolution design to future product lines and extend its role in precision additive manufacturing.
Patent Activity Reflecting Broader 3D Printing Innovation Trends
Patents in 3D printing protect new inventions and encourage investment by giving inventors exclusive rights to their ideas. They also promote innovation by sharing technical knowledge while helping companies avoid infringement and maintain a competitive edge.
Earlier this July, Buffalo-based post-processing systems manufacturer PostProcess Technologies was granted its 50th patent by the USPTO. The company’s patents cover hardware, chemistry, and software designed to automate resin cleaning, support removal, and surface finishing across various 3D printing methods. Founded in 2014, PostProcess has delivered more than 800 systems, including its DEMI and BASE product lines, which are used in production environments to standardize post-print workflows and reduce manual labor.
In a separate development, IBM, headquartered in New York, received U.S. Patent No. 12,340,150 B2 for a process that enables the virtual reality design of 3D printed buildings. Filed in June 2021 and published in December 2022, the patent describes a simulation engine that models environmental factors such as noise, airflow, lighting, and temperature before construction. The method allows architects to adjust layouts and materials within the VR environment and then export finalized designs to construction-scale 3D printers. Co-inventors Subha Kiran Patnaikuni and Sarbajit K. Rakshit are credited with developing the system, which aims to improve accuracy and functionality in 3D printed structures.
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Featured photo shows the microArch D1025. Photo via Boston Micro Fabrication.
