Orbotech LTD., are a leading provider of process innovation technologies, solutions and equipment enabling the transformation of the global electronics manufacturing industry. They have announced that their Orbotech Inkjet™ 600 system has been selected by Amkor Technology, Inc., a leading provider of semiconductor packaging and test services.
By using the Orbotech Inkjet 600 to print high aspect ratio, 3D underfill dams for new system-in-package (SiP) products, Amkor aims to maximize its manufacturing flexibility, increase its feature position accuracy and reduce its design-to-manufacturing lifecycle.
“Amkor’s use of Orbotech Inkjet 600 for 3D printing is a significant implementation of process innovation in high-volume semiconductor packaging,” said Mr. Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech. “We are experiencing a great deal of interest in inkjet printing from the packaging industry, for applications ranging from underfill dams to package marking to the direct printing of isolation layers. We believe that this may be the beginning of an industry trend towards adopting additive manufacturing solutions for seamless production processes. Our Orbotech Inkjet 600 offers device manufacturers unprecedented flexibility in product development, reduced cycle times and lower overall cost of ownership.”
“Amkor’s emphasis is on functional integration and size reduction by using different package and interconnect technologies for System-in-Package offerings,” commented JuHoon Yoon, Amkor’s R&D Vice President in Korea. “By investing in solutions such as Orbotech Inkjet 600 for printing of underfill dams as opposed to conventional methods, we enable higher levels of integration in smaller form factors for our customers.”
Underfill dams prevent leakage between active and passive components and are an essential process in SiP packaging for both device and sub-component substrates. With its high-accuracy printing capability, the Orbotech Inkjet 600 enables the formation of tall underfill dams in a single step with real-time local alignment correction for tighter integration of components. This not only leads to a shorter process by replacing existing cumbersome, subtractive processes, but also significantly lowers manufacturing costs.
Orbotech, together with SPTS Technologies, an Orbotech company, will be exhibiting at SEMICON West, Booth No. 1417 (South Hall) from July 12-14 in San Francisco.
About Orbotech Inkjet™ 600
Orbotech Inkjet™ 600 provides cost-effective, high quality additive printing solutions for IC packaging production. Based on Orbotech’s advanced DotStream Pro Technology™, the Inkjet 600 prints fine lines and uniform thin layers at any angle and on a wide range of materials. Its sophisticated automatic measurements and scaling modes enable market-leading registration and accuracy. The Orbotech Inkjet 600 offers flexible, cost efficient solutions forIC packaging applications, including tall, high-aspect ratio 3D dams (ratio of 1:4), accurate isolation layers, IC units marking and serialization.
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com and http://www.spts.com
